T3ster
Three Thermal Simulation & Test Innovations for Electronics Equipment Design
Over the last 50 years the automotive industry has been going through huge shifts in electrification. And of course, we are seeing the electric motor starting to replace the mechanical engine with the advent of Electric & Hybrid vehicles. View the whitepaper to learn more!
No More Guessing. Why You Need to Calibrate IC Package Models
Accurate IC thermal models calibrated against thermal measurement allow IC designers and system integrators to better design for cost and reliability. This whitepaper addresses overcoming barriers with typically time intensive manual iterative methods by using a unique automatic calibration method to achieve higher comparative accuracy by as much as 20 percent in less time.
The new method is illustrated using Simcenter FlothermTM software thermal simulation software and transient thermal measurement data.
Three Thermal Simulation & Test Innovations for Electronics Equipment Design
- Placement of measurement locations in models so that the gap between actual measurements and analysis can be identified
- Preliminary verification of component Tj (junction temperature) value by CFD thermal analysis
- Creation of compact models from manufacturer datasheets and Tj calculations - what we call a DSRC, Datasheet Resistance Capacitance model
How To… Optimize IGBT Design using T3Ster®& FloTHERM® - A salient example
Several decades ago “Something smells like burning silicon” was the standard exclamation for determining the existence of a thermal design problem. The industry has come a long way since then, using simulation tools, thermal characterization and other techniques to make systems more robust.
View the whitepaper to learn more!
