Electronics IC package thermal modeling
It is commonly accepted that two of the trends in the electronics industry are miniaturization and the electrification of all things. As a result, electronics today are deployed in dynamic and sometimes harsh environments. As the environments have changed, so have the requirements for the system integrators. Today, companies need integrated circuit (IC) package models that can accurately predict dynamic thermal performance.
7 key considerations for effective chip-package thermal co-design
What you’ll learn:
- Why chip-package thermal co-design is important
- When chip-package thermal co-design is essential