HyperLynx for PCB Simulation

HyperLynx offers a complete suite of design analysis and verification software that meets the needs of PCB engineers at any point in the board design flow. Easy to use and integrate into your flow, HyperLynx equips hardware design engineers and PCB designers to efficiently analyze, identify, resolve, and verify critical design issues, which prevents costly re-spins, reduces design cycle times, and improves product reliability.

HyperLynx Signal Integrity (SI):

Generates fast, easy and accurate signal integrity analysis in PCB systems design. View electrical waveform shapes in a virtual environment (LineSim & BoardSim) to develop constraints based on Technology, Termination, Topology and Trace Parameters.

HyperLynx Power Integrity (PI):

Uses a virtual environment to identify potential DC power delivery issues such as excessive voltage drop, which can lead to IC malfunction. Optimizes the impedance of your power distribution network(PDN). Uses analysis to make effective decisions on how many capacitors are really needed to make your PDN work, and where to place those caps and how to mount them.

HyperLynx Design Rule Checking (DRC):

Enhance PCB development by using an automated design review approach that can be used iteratively, to identify design violations that lead to signal integrity, power integrity, creepage, clearance, analog and EMI/EMC issues, eliminating manual inspection and PCB cycle bottlenecks. Reduces the PCB design review process by providing automated reporting capabilities.

HyperLynx Full-Wave Solver-3D:

Broadband, full-wave electromagnetic field solver for SI, PI, and EMI. Achieve greater accuracy and fewer re-spins, even on the most complex structures.

HyperLynx Fast 3D Solver:

Enables efficient, full package model creation with multi-processing for faster turnaround time. It is ideally suited for power integrity, low-frequency SSN/SSO, and complete-system SPICE model generation while accounting for skin effect impact on resistance and inductance.

HyperLynx Thermal:

Analyzes board-level thermal conditions on placed, partially routed, or fully routed PCBs. It simulates conduction, convection and radiation, and produces temperature profiles, gradients, and excess temperature maps, resolving board and component overheating early in the design process.

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