Field Lifetime estimation of power modules using Active Power Cycle
The design of power electronics modules and power packages is heavily influenced by thermal concerns. New substrate materials, thinner and thermally more conductive attachment materials are used to decrease the thermal resistance of a given module. When a new material or technology is applied, its reliability has to be tested thoroughly before the module can be considered for production.
A method to test power electronics module lifetime
A new method for characteristic measurement and reliability testing of thermally sensitive power electronics modules is more efficient and gets to the problem quicker.